Si4710/11-B30
Rev. 1.1
33
9. Package Markings (Top Marks)
9.1. Si4710 Top Mark
Figure 19. Si4710 Top Mark
9.2. Si4711 Top Mark
Figure 20. Si4711 Top Mark
9.3. Top Mark Explanation
Mark Method:
YAG Laser
Line 1 Marking:
Part Number
10 = Si4710
11 = Si4711
Firmware Revision
30 = Firmware Revision 30
Line 2 Marking:
R = Die Revision
B = Revision B Die
TTT = Internal Code
Internal tracking code.
Line 3 Marking:
Circle = 0.5 mm Diameter
(Bottom-Left Justified)
Pin 1 Identifier
Y = Year
WW = Workweek
Assigned by the Assembly House. Corresponds to the last sig-
nificant digit of the year and workweek of the mold date.
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